Opportunity brief
Closes in 9 daysRequirement of multiple Lap and Polish Tools
The National Research Council Canada (NRC) has a requirement for multiple lapping and polishing tools to support the CPFC’s modernization to 4” wafer processing capability. Lapping and polishing equipment are mission critical for a photonics foundry producing waveguides, modulators, lasers, filters, or integrated photonic circuits. These tools ensure substrate flatness, surface quality, and thickness uniformity, all of which directly affect optical performance, coupling efficiency, and device yield. The CPFC has a requirement to update its aging lapping and polishing tools degrade as they currently contribute to manufacturing risks to yield, optical performance, process stability, and throughput. Replacing aging tools is essential to maintain foundry grade capability, support customer programs, and prevent production interruptions as the CPFC progresses to 4” wafer processing capability. The CPFC requires the procurement of: o Three (3) Modular Wafer Bonding System o One (1) LP70 multi-station lapping and polishing system o One (1) PP6GT Precision Polishing Jig with Vacuum adaptor o One (1) CG10 Contact Measurement Gauge o One (1) Solvent Vapour Cleaner NRC is investing in semiconductor fabrication infrastructure and related research capabilities to strengthen Canada’s compound semiconductor innovation and commercialization pipeline. As part of this initiative, the Canadian Photonics Fabrication Centre (CPFC) is transitioning to a 4” wafer processing photonics foundry which includes the modernization of its aging lapping and polishing equipment. These upgrades will enable CPFC to deliver photonic devices with tightly controlled variability in critical parameters (roughness, thickness, flatness, etc) and tightened tolerance specifications (facet polishing, high-flatness bonding surfaces) while decreasing maintenance costs and downtime.
- Other sectors
- Public sector
- Canada

- Buyer / issuer
- National Research Council of Canada (NRC)
- Sector
- Other sectors
- Country / region
- ON, Canada
- Public or private
- Public sector
- Closing date
- 16 Nov 2026, 16:00 SAST
- Closes in 9 days
- Estimated value
- Not stated
- Submission method
- As per the notice on CanadaBuys
- Tender number
- 26-58197
- Status
- Active
Scope summary
The National Research Council Canada (NRC) has a requirement for multiple lapping and polishing tools to support the CPFC’s modernization to 4” wafer processing capability. Lapping and polishing equipment are mission critical for a photonics foundry producing waveguides, modulators, lasers, filters, or integrated photonic circuits. These tools ensure substrate flatness, surface quality, and thickness uniformity, all of which directly affect optical performance, coupling efficiency, and device yield. The CPFC has a requirement to update its aging lapping and polishing tools degrade as they currently contribute to manufacturing risks to yield, optical performance, process stability, and throughput. Replacing aging tools is essential to maintain foundry grade capability, support customer programs, and prevent production interruptions as the CPFC progresses to 4” wafer processing capability. The CPFC requires the procurement of: o Three (3) Modular Wafer Bonding System o One (1) LP70 multi-station lapping and polishing system o One (1) PP6GT Precision Polishing Jig with Vacuum adaptor o One (1) CG10 Contact Measurement Gauge o One (1) Solvent Vapour Cleaner NRC is investing in semiconductor fabrication infrastructure and related research capabilities to strengthen Canada’s compound semiconductor innovation and commercialization pipeline. As part of this initiative, the Canadian Photonics Fabrication Centre (CPFC) is transitioning to a 4” wafer processing photonics foundry which includes the modernization of its aging lapping and polishing equipment. These upgrades will enable CPFC to deliver photonic devices with tightly controlled variability in critical parameters (roughness, thickness, flatness, etc) and tightened tolerance specifications (facet polishing, high-flatness bonding surfaces) while decreasing maintenance costs and downtime.
Category: GD
Key requirements
- Procurement method: Advance contract award notice
- Briefing session: Not captured. Check the original notice before relying on this.
- Eligibility and evaluation: set out in the tender documents. Check mandatory returnables, registrations and scoring before you commit.
Required documents
The tender pack is published with the original notice. Use “Download Tender Pack” to open it.
Important dates
- Published
- 30 Oct 2026
- First seen by Atlas
- 01 Nov 2026
- Briefing session
- Not captured. Check the original notice before relying on this.
- Submission deadline
- 16 Nov 2026, 16:00 SAST
Commercial snapshot
- Estimated value
- Not stated in the notice
- Contract type
- Advance contract award notice
- Category
- GD
- Source
- CanadaBuys
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